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BE Semiconductor Industries/€BESI

1D1W1M3M6MYTD1Y5YMAX

About BE Semiconductor Industries

BE Semiconductor Industries N.V. is a company operating in the semiconductor equipment industry. It specializes in the design, manufacturing, and marketing of assembly equipment for the semiconductor industry, focusing primarily on wafer-level packaging and leadframe-based systems. Founded in 1995 and headquartered in Duiven, Netherlands, the company serves a global customer base, including leading semiconductor manufacturers and electronics companies. Its strategic positioning is strengthened by its advanced technology solutions that enhance production efficiency and address miniaturization needs in semiconductor assembly. The company's competitive strengths include its innovation in packaging technologies and a strong focus on research and development.
Ticker
€BESI
Sector
Semiconductors
Primary listing
AEX
Employees
2,001
Headquarters
Duiven, Netherlands
Website
www.besi.com

BESI Metrics

BasicAdvanced
€12B
41.86
€3.64
1.30
€1.58
1.04%

What the Analysts think about BESI

Analyst ratings (Buy, Hold, Sell) for BE Semiconductor Industries stock.
Analyst projections of the future price of BE Semiconductor Industries stock.

Bulls say / Bears say

Besi’s Q3 orders rose 96% year on year and 17% quarter on quarter, while revenue more than doubled year on year. Higher sales and margins lifted net income to €107.2 million, showing strong earnings leverage as demand grows. (Besi)
Hybrid bonding orders more than doubled year to date against all of 2025, and Besi reports adoption by 23 customers with cumulative demand above 215 systems. Orders are coming from logic, memory, co-packaged optics and edge AI, widening the technology’s potential beyond a single use case. (Besi)
Besi’s expanded partnership with Applied Materials covers hybrid bonding as well as thermo-compression bonding, panel integration and photonics applications. The collaboration could help Besi develop and commercialise equipment for the AI industry’s growing need for denser chip connections. (Applied Materials)
Besi expects Q4 revenue to be roughly flat against Q3, with gross margin lower and operating expenses higher. That guidance points to a near-term pause in growth even after the sharp rise in orders. (Besi)
The timing and scale of hybrid bonding for high-bandwidth memory remain uncertain: memory shortages have extended the use of lower-stack designs, while customers prioritise capacity. If memory makers delay switching, a major expected source of future equipment demand may arrive later than investors expect. (Reuters, Besi)
A report based on ASML patent filings suggested the larger chip-equipment maker may be developing a competing hybrid-bonding tool. ASML has not confirmed this, but the prospect could threaten Besi’s position in an important growth market. (Reuters)
Data summarised monthly by Lightyear AI. Last updated on 27 Oct 2026.

BESI Financial Performance

Revenues and expenses
Income statement
QuarterlyAnnual
Q3 24
QoQ growth
Revenue
Net income
Profit margin

BESI Earnings Performance

Company profitability
Earnings per share
QuarterlyAnnual
Q4 23
Q1 24
Q2 24
Q3 24
Q4 24
Actual
Expected
Surprise

Funds containing BESI

AllEURUSDGBP
Funds
Fund name
Fund size
€BESI weighting
iShares MSCI Europe Information Technology£ESIT
€243M1.66%
iShares STOXX Europe 600 Technology€STEC
€26M1.45%
iShares STOXX Europe 600 Technology€EXV3
€224M1.45%
iShares AEX€IAEX
€781M1.18%
iShares AEX£IAEX
€781M1.18%
Data displayed above is indicative only and its accuracy or completeness is not guaranteed. Actual execution price may vary. Past performance is not indicative of future results. Your return may be affected by currency fluctuations and applicable fees and charges. Capital at risk.
Market data provided by CBOE Europe and Deutsche Börse.